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Basic terminology in the electroplating process

Angelina Dong original 2015-08-11 15:18:35
Suzhou Houdry Mechanical And Electrical Technology Co.,Ltd
1 the dispersion
Under certain conditions, a certain solution to make electrodes (usually) cathode plating distribution than the results gained by the initial current distribution more uniform.Also called throwing ability.
2 coverage
Plating solution under certain conditions grooves or deep hole in the ability of deposited metal.Also known as the deep plating ability.
3 Yang very
Can accept the reactants have given electronic electrodes, the oxidation reaction of electrode.
4 insoluble anode
When an electric current passes through, the anodic dissolution reaction electrode.
Five cathode
Reaction on it to obtain the electronic electrodes, the electrode reduction reaction.
Six current density
Electrode through the current strength of per unit area, usually expressed in A/dm2.
7 current density range
Can obtain qualified coating the current density range.
Eight current efficiency
Electrode through the unit capacity, the weight of the first reaction product formed with the ratio of the electrochemical equivalent, usually expressed as a percentage.
Nine Yin polarity coating
Numerical than base metal electrode potential of the generation of metal coating.
10 the anode sex coating
Numerical smaller than base metal electrode potential of the generation of metal coating.
11 anode slime
After the anodic dissolution current of the residue.
12 deposition rate
Unit time deposits out of the thickness of the metal parts surface.
13 primary current distribution
The electrode polarization does not exist, the distribution of electric current on the electrode surface.
14 live,
The role of the metal surface passivation state disappear.
15 is blunt,
In certain circumstances to dissolve metal surface normal reaction is severely hampered, and in a wide range of electrode potential to make metal dissolution reaction rate is very low.
Hydrogen embrittlement of 16
Due to erosion, oil removal or plating process, the metal or alloy absorption hydrogen brittleness.
17 PH
The logarithm of the hydrogen ion activity aH + negative.
18 substrate materials
Can form a film layer on the deposition of metal or materials.
19 auxiliary cathode
In order to eliminate plated parts on the parts due to the power line is too concentrated and problems such as burrs and burning, near the area plus some in the shape of the cathode, to consume current, this additional cathode is auxiliary cathode.
20 auxiliary anode
In addition to the normal things in electroplating anode, in order to improve the plated parts on the surface of the current distribution and the use of auxiliary anode.
21 electric solution
Take the current through the electrolyte solution in the anode, cathode process of REDOX reaction.
22 a,
When an electric current passes through the electrode, electrode potential occurred the phenomenon of deviating from the equilibrium potential.
23 saponification reaction
Under the condition of the grease in alkaline hydrolysis reaction.
24 cathodic polarization
When direct current through the electrode, cathode potential deviating from the equilibrium potential to move in the direction of the negative phenomenon.
25 cell voltage
The electrolysis, the total potential difference between the poles.